SC 2.6 | Invited to interview? Prepare for success with job applications and interviews in industry and academia
Invited to interview? Prepare for success with job applications and interviews in industry and academia
Convener: Hazel Gibson | Co-convener: Simon ClarkECSECS

The job market in both industry and academia can be a very challenging environment, especially for those either just completing a course of study, or looking to change sectors. Trying to get your application to stand out is a task that comes with a lot of unknowns, even after years of experience in higher or further education. Preparing for a higher level job application or interview is a useful skill that develops as you advance in your career – with new aspects being added with each new position you aim for. Once you get invited to interview, this process in itself bring a whole new set of challenges that range from: online vs in-person interviews; interview protocol; accommodations and reasonable requests; expected time-frames; anticipating questions; gauging employer culture and more.

This short course aims to bridge this gap to employment by drawing on the experience of senior career workers in both industry and academia, as well as HR professionals, to provide specific advice for anyone who is in the process of submitting a job application or preparing for interview. This short course will address questions such as: what to include or not in a cover letter and job application; what are the different kinds of CV and when you should use them; how to prepare for an online or in-person interview; what are some of the signs you can look for to identify workplace culture; and what questions you should ask in an interview.

As a practical exercise, this short course will conclude with a mock interview; a list of questions that could be asked of applicants in a limited time environment, with feedback available from the presenters. Short course participants will leave feeling more prepared and confident in their skills for navigating the job market.